Center for Physical Sciences and Technology

FTMC exploits the equipment that is originally made and obtained from world leading companies. We share a part of equipment between the individual groups and individual modules of technologies for overlapping tasks and processes that are carried out in the basic clean room area. We have special measures to prevent interference between separated tasks and R&D projects. We also have dedicated equipment with original functional features. The infrastructure of FTMC:

- Clean room facilities (about 300 sq. m; from ISO7 to ISO5).

- MBE machine: "SVT III-V MBE System Model C-V-2" for the growth of A3B5 semiconducting layers and quantum structures. The device is equipped with In, Ga, Al, Bi metallic sources, As bulk and cracker and Si and Be for doping.

- Integrated Vacuum Deposition System Model TFDS- 870 – intended for metal contacts deposition.

- Magnetron sputtering device EvoVac (Angstrom Engineering) with 4 guns and Kaufman and Robinson EH400 5A  ion gun.

- E-beam vacuum deposition system: Integrated Vacuum Deposition System Model TFDS- 870 VST (Israel).

- PECVD reactor (diameter 100 mm) from SVC (Czech Republic) with 4 gas lines.

- CVD reactor (diameter 100 mm) Nobertherm GmbH (Germany).

- Atomic layer deposition equipment  Fiji 200 with plasma module and ozone generator (Ultratech/Cambrige NanoTech).

- Rapid thermal annealing ovens RTP 100HV and RTP-1300 (Unitemp).

- Laser lithography DWL66+ (Heidelberg Instruments, Germany).

- Mask aligner MJB3 (Karl-Suss).

- Wet chemical process room with 4 workplaces and tools.

- Electrochemical process bench.

- System for ultrashort pulse laser ablation based on the “Pharos”laser (Light Conversion).

- Nanosecond laser system based on DuoMaster 5 axis system (ELAS) with 10 ps Atlantic laser (Ekspla).

- Glass marking/welding lasers from Ekspla.

- DPN station based on Veeco CP-II AFM with NanoWRTIE.

- UV illumination setup, plasma cleaner, chemical wet bench work places, spin-coaters,

- X-ray diffractometer SmartLab (Rigaku, Japan, 2011): 9 kW x-ray tube with rotating Cu anode and specific modules.

- X-ray diffractometer D8 Advance (Bruker AXS, Germany).

- Fluorescent x-ray spectrometer with wave dispersion (WDXRF) Axios mAX (Panalytical, Netherlands).

- Scanning electron microscope Helios NanoLab 650 (FEI, Netherlands).

- Scanning electron microscope EVO-50 EP (Carl Zeiss SMT, Germany).

- Transmission electron microscope Tecnai G2 F20 X-TWIN (FEI, Netherlands), etc.

The complete list of available equipment with more details can be found on the FTMC website www.ftmc.lt; processing technologies - www.baltfab.com; prototype formation and integration - pfi.ftmc.lt.

1. Photonics:

1.1. Laser processing:

1.1.1. in-glass marking;

1.1.2. laser beam interference ablation;

1.1.3. laser direct writing;

1.1.4. ultrashort pulse laser ablation;

1.2. Optoelectronics:

1.2.1. development and applications of terahertz time-domain spectroscopy systems;

1.2.2. development and fabrication of infrared light emitters and photodetectors;

1.2.3. development and testing THz imaging arrays for security and diagnostics systems;

1.2.4. terahertz and broadband spectroscopy;

1.2.5. MBE growth of dilute bismide layers for infrared light emitters and photodetectors;

1.3. Prototyping:

1.3.1. photolithography;

1.3.2. laser lithography;

1.3.3. wet chemical processing;

1.3.4. thermal processing;

1.3.5. metal and oxide coatings;

1.3.6. assemblage and testing;

1.3.7. clean room (ISO7 – ISO5, about 300 sq. m) operations.

2. Advanced Materials:

2.1. Material development for special coatings, photovoltaics, sensors:

2.1.1. advanced optical materials: synthesis of organic compounds for photovoltaic devices, coatings for laser systems, etc.;

2.1.2. advanced functional materials: synthesis of nanostructured materials for coating with special properties, e.g. protective, antibacterial, etc.;

2.1.3. the methods acceptable to characterize, test and select the advanced materials;

2.1.4. nanostructured and low-dimension materials, including nanoparticle coatings, 2D materials (graphene and MoS2) and more;

2.1.5. sensors: THz emission, microwaves, magnetic field, chemical compounds, volatile compounds, environment pollutants;

2.1.6. spectroscopic characterization of optical properties, Raman analysis.

2.2. Structural analysis:

2.2.1. Determination of chemical composition of a solid material by EDX or WDX in a scanning electron microscope (SEM);

2.2.2. Imaging of surface of solid materials by scanning electron microscope (SEM);

2.2.3. Study of inner crystalline structure and chemical composition of solid materials by transmission electron microscope (TEM);

2.2.4. Study of crystalline structure and phase composition of polycrystalline materials by x-ray diffraction (XRD);

2.2.5. Determination of texture of polycrystalline materials by pole figure method;

2.2.6. Determination of residual stress by XRD method;

2.2.7. Study of crystalline structure and phase composition of polycrystalline materials by XRD at elevated temperatures;

2.2.8. Study of phase composition and crystalline structure of polycrystalline materials by XRD at a selected area (microdiffraction);

2.2.9. Study of epitaxial layers and thin films by high resolution XRD (HRXRD and XRR);

2.2.10. Study of phase composition and crystalline structure of thin polycrystalline films by XRD In-plane method;

2.2.11. Determination of size distribution of nanoparticles and nanopores (1-10 nm) in thin films;

2.2.12. Determination of chemical composition by x-ray fluorescence spectroscopy with wave dispersion (WDXRF);

2.2.13. Determination of carbon and sulphur in powdery materials and metallic articles;

2.2.14. Determination of chemical composition of thin films by x-ray photoelectron and Auger electron spectroscopy.

3. Nanotechnology:

3.1. Molecular:

3.1.1. dip pen nanolithography;

3.1.2. microcontact printing;

3.1.3. piezoelectric InkJet printing;

3.1.4. colloidal nanolithiography.

3.2. Analytical:

3.2.1. bio AFM;

3.2.3. electrochemical sensors;

3.2.4. imaging surface plasmon ellipsometry;

3.2.5. SEM with EDS-WDS elemental analysis.

4. Micro and nanoelectronics:

4.1. Technologies and processes:

4.1.1. clean room operations;

4.1.2. laser lithography and photolithography;

4.1.3. silicon based technology: diffusion and annealing;

4.1.4. silicon surface texturing and deep etching.

4.2. Applied models and testing:

4.2.1. SPM scanning;

4.2.2. optical and electrical characterization;

4.2.3. assemblage and encapsulation;

4.2.4. applications in photovoltaics, optoelectronic devices.

The complete list of the services and more details can be found on the FTMC website www.ftmc.lt; processing technologies - www.baltfab.com; prototype formation and integration - pfi.ftmc.lt.