Fraunhofer IZM

SYSTEM INTEGRATION

Wafer-Level Packaging Line
Fraunhofer IZM operates two process lines (cleanroom class 10 – 1000) in Berlin (975 m²) and Dresden (ASSID, 1000 m²), that offer our customers various wafer-level packaging services from development stage to prototyping and small volume production. Different substrate materials (e. g. silicon, III/V, ceramic and glass) and wafer sizes (4” –12”) can be processed. Project and process work on both lines is executed in compli-ance with ISO 9001:2015 management standards.

Process Modules:

• Cu-TSV integration (via-middle and via-last-processes)
• Silicon and SiC plasma etching – DRIE (TSV, cavities)
• Thin-film deposition (sputter, CVD, photolithography, reactive ion beam etcher)
• PECVD process chamber (200 / 300 mm) for the deposition of TEOS oxide, Silane oxide and Silane nitride
• High-density thin-film multilayer (Cu / polymer RDL)
• Wafer-level bumping (Cu-Pillar, SnAg, Ni, Au, In, AuSn)
• Wafer thinning und thin wafer dicing (blade, laser grooving and stealth dicing)
• Wafer bonding – permanent and temporary
• Wafer level assembly up to 300 mm (D2W)
• Automatic inline wafer measurement system (200 / 300 mm) for layer thickness, topographies, roughness as well as TTV / warpage / bow
• Fully automated electric wafer measurent system

Substrate Line
In the substrate 460 x 610 mm² area panel-size substrates can be prepared for resist and PCB lamination, solder resist and cover lays can be applied and developed after exposure. In our bonding lab high-precision module assembly is carried out under inert gas. New equipment in the 480 m² cleanroom allows surface preparation for assembly at reduced bonding temperatures.

Our services include:

• Embedding of passive and active components
• Multilayer lamination of PCB substrates
• Realization of smallest vias, mechanically as well as with a laser
• Quality assessment and X-ray microscopical analysis

Mold Encapsulation Lab
The lab offers various encapsulation processes, related material and package analysis and reliability characterization tools as a one-stop-shop. The focus is on FO-WLP / PLP on sensor pack-ages with freely accessible surface and on power SiPs.

• Precision assembly and compression molding on wafer and panel level (610 x 460 mm2)
• Redistribution in 2D (PCB-based and thin film) and 3D (TMV)
• Transfer molding of SiPs for sensors and power
• Process simulation and analysis of material models

Transfer to industrial production is guaranteed due to use of production equipment.

Wire Bonding Lab

• Processing of Au-, Al- and Cu-based bonding wire materials for thin and heavy wire bonding
• Assembly of power modules using Al / Cu- and Cu-heavy wires for quality and reliability analyses
• Assembly of sensor packages using Cu-ball / wedge bonding for lead frames and Au / AlSi1 wires for COB processes Soldering Lab
• Vapor phase soldering with vacuum enables manufacturing of voidless large area solder joints for power electronics
• Fluxless soldering of printed circuit assemblies using active gas in oxygen free Nitrogen or vapor phase atmosphere
• Hermeticity test
• Leak testing including Helium bombing up to a pressure of 10 bar

Photonics Lab

• Laser structuring of glass layers with optical waveguides for electro-optical boards (EOCB)
• Shack-Hartmann-characterization of micro lenses and micro lense arrays
• Optical and thermal characterization of LEDs and LDs
• Research and development of optical packaging processes with an accuracy of up to 0.5 μm

MATERIAL ANALYSIS

Moisture Lab

• Comprehensive simulation-based reliability assessment of humidity-induced phenomena in microelectronic components and systems
• Surface analysis through atomic force microscopy
• Analysis methods for sorption, permeation and diffusion of water in materials
• Molecular-dynamic simulationLong-term Testing and Reliability Lab
• Fast temperature cycling tests in the range from -65 °C to 300 °C
• Temperature storage up to 350 °CPower Lab
• Testing of hetero highly integrated of power modules
• Active cycling of power modules for lifetime assessment
• Calorimetric measurement of the effectiveness of highly efficient devices

DESIGN

High Frequency Lab

• Free-space measuring station up to 170 GHz, Fabry-Perot resonators up to 140 GHz and THz system for HF material characterization
• Semi-automatic sample station with thermal chamber (-60 °C to 300 °C)
• EMC and test environment for wireless communication sys-tems in the multi-gigabit and terabit-range
• Antenna measuring system for up to 330 GHz
• Test lab for mm wave modules for radar and communication, signal source (AWG) and spectrum analyzer up to 325 GHz
• Time range measuring station (sample oscilloscope up to 70 GHz / BERT up to 64 Gbit/s)Microelectronics Lab
• Development and qualification of mechatronics systems and energy-efficient wireless sensor systems
• PXA for range calculation, conformity checks, and failure analyses; allows the recording of very fast signals (from 162 μs)

Further laboratories include:

• Micro Battery Lab with 10-meter battery development and assembly line
• Laboratory for Textile-integrated Electronics (TexLab)
• Photoelectron spectroscopy and electron spectroscopy for chemical analysis (ESCA)
• Corrosion Lab
• Electronics Condition Monitoring Lab (ECM) for functional tests of electronic systems under environmental stress, salt spray, shaker
• Qualification and Test Center for Electronic Components (QPZ)
• Thermo-mechanical Reliability Lab
• Thermal & Environmental Analysis Lab

• Feasibility studies

• Product Development Consultation

• Process and Product Development

• Manufacturing & Prototyping

• Testing, Qualification, Reliability

• Training

• Lab collaborations